Ansys unveils new technologies and platform enhancements

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Ansys 2020 R2 has been launched to provide enhanced solving and collaboration capabilities using high-performance computing (HPC), benefitting users across many major industries.

These newly updated advanced digital engineering tools are intended to help engineering teams develop new products, sustain business continuity and improve productivity.

With engineering teams facing the challenge of solving complex designs and meeting demanding product development schedules while working remotely, Ansys’ next-generation engineering simulation software, high-performance computing (HPC) resources and platform solutions look to support global collaboration and improve information sharing.

Ansys 2020 R2 significantly upgrades these tools, providing highly advanced solutions which reduce costs and speed production.

Ansys 2020 R2 will help teams accelerate innovation in any environment by harnessing new workflows and dynamic capabilities across Ansys’ flagship suites. Updates in Ansys Cloud offerings, such as virtual desktop infrastructure support, unite Ansys’ flagship simulation solutions with highly scalable compute power delivered by cloud-based HPC.

Platform solutions enhanced with powerful workflows are able to deliver a streamlined user experience with improved functionality for data and configuration management, dependencies visualisation and decision support, as well as user-friendly workflows for process integration and design optimisation and materials management.

Ansys’ digital twin solutions enable remote monitoring of assets and are a critical component for predictive maintenance.

Collectively these resources, according to Ansys, will help engineers generate larger, more complex designs easier and faster than ever, increase productivity, spur development of high-quality products and expedite time to market.

Ansys 2020 R2 improves deployment, scalability and performance of AI-based perception software testing through multi-GPU parallelisation, making it easy to systematically identify hazards and comply with new safety standards like Safety of the Intended Functionality (SOTIF).

In support of automotive electrification, a new thermal and vibrational analysis coupled with Ansys’ electromagnetic field simulation software will help predict reliability and noise, vibration and harshness. Additionally, modelling thermal behaviour of batteries during all stages of the design cycle has been made easier by using a streamlined workflow and new capabilities that simulate the important effects of capacity fade and cell life.

Supporting 5G, Ansys 2020 R2 advances phased array antenna analysis to enable engineers to simulate larger, more complex designs with scalable leveraging of HPC. Additionally, engineers may leverage significant advances for integrated circuit (IC), package and board workflows, enabling electronics reliability and electrothermal modelling. Lastly, on-chip device modelling combined with 3D electromagnetic simulation software provides gold standard verification for sensitive ICs.

Author
Neil Tyler

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, New Electronics News reports

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